[vc_row full_width=”stretch_row” content_placement=”middle” css=”.vc_custom_1615985501224{background-color: #2d8791 !important;}”][vc_column width=”1/2″][vc_column_text]

Silicon wafer fabrication for microelectronics

[/vc_column_text][/vc_column][vc_column width=”1/2″ css=”.vc_custom_1623854748031{background-image: url(https://gr2l.co.uk/wp-content/uploads/2021/06/shutterstock_1693411333-900px.jpg?id=2369) !important;background-position: center !important;background-repeat: no-repeat !important;background-size: cover !important;}”][vc_empty_space height=”190px”][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]The same CZ process that is used to produce silicon ingots for solar PV applications is used to crystallise ingots for semiconductor applications, however, the ingots are typically 12” diameter rather than the 8” predominantly used in solar applications, the purge gas purity is higher, and the purge gas flows are typically doubled compared to the solar application.[/vc_column_text][/vc_column][/vc_row]